Abstract: The through silicon via (TSV) arrays play the role of vertical electrical interconnections in the 3-D stacked integrated circuits. However, the coupling crosstalk between the adjacent TSVs ...

Abstract: Extremely large-scale multiple-input multipleoutput (XL-MIMO) systems emerge as a critical enabler for $\mathbf{6 G}$ networks demanding enhanced spectral efficiency. The adopted extremely ...

In a hangar-like building in Louisville, Colorado, outside Denver, crumpled plastic bottles, cans and other scraps were strewn across a giant conveyor belt. But you know what they say about one man’s ...

We describe a concrete device roadmap towards a fault-tolerant quantum computing architecture based on noise-resilient, topologically protected Majorana-based qubits. Our roadmap encompasses four ...